Starting from the CPU Socket the LGA-1366 Socket is facing towards the left side of the board which is normal for the new interface. The CPU area is clear of obstacles with two rows of low-h capacitors on the left hand side of the socket and the bottom of the socket. The Northbridge is covered by a heatsink with a heat pipe going to a heatsink that covers the MOSFETs. The Southbridge is covered by another heatsink but is not connected to the NB by heat pipe.
There are six DIMM Sockets on the board that take either ECC or non-ECC DDR3 memory. One thing that should be noted is that the memory controller is on the CPU and only DDR3-1066MHz is supported officially supported. XMP memory is supported for the higher clocked profiles when the memory is installed. To install three DIMMs in Triple Channel Memory mode you need to install the memory in the white memory slots.
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